嘉硕32.768K晶体,TZ2065A无源晶振,2012mm小体积晶振,6G无线模块晶振,尺寸2.0*1.2mm,频率32.768KHZ,台湾晶振,超小型晶振,两脚贴片晶振,进口音叉晶振,SMD晶振,水晶振动子,无源晶体,石英晶体,音叉晶体,时钟晶振,32.768KHZ晶振,2016mm贴片晶振,轻薄型晶体,低损耗晶振,低成本晶振,低功耗晶振,高性能晶振,高品质贴片晶振,儿童游戏机晶振,时计专用晶振,数码相机晶振,电话机晶振,蓝牙耳机专用晶振,产品具有轻薄小低损耗的特点.
32.768K晶振产品适用于范围非常广泛,比较适合用于儿童游戏机,时计,数码相机,电话机,蓝牙耳机等领域。嘉硕32.768K晶体,TZ2065A无源晶振,2012mm小体积晶振,6G无线模块晶振.
嘉硕32.768K晶体,TZ2065A无源晶振,2012mm小体积晶振,6G无线模块晶振参数表
TZ2065A | Specification |
NominalFrequency | 32.768000KHz |
Storage TemperatureRange | -40°Cto+85°C |
Operating TemperatureRange | -40°Cto+85°C |
Turnover Temperature | 25+/-5°C |
Parabolic CurvatureConstant | -0.027ppm/°C2max. |
FrequencyMakeTolerance(FL) | +/-20 ppm@25°C+/-3°C |
EquivalentSeriesResistor(ESR) | 90 Ωmax. |
Nominal DriveLevel | 10uW |
ShuntCapacitance(Co) | 2.0 pFmax |
DriveLevel | 0.5uWmax. |
LoadCapacitance(CL) | 12.5pF |
Aging | +/-3.0ppm/year@25°C |
Marking | Lasermarking |
InsulationResistance | 500MΩmin atDC100V |
嘉硕32.768K晶体,TZ2065A无源晶振,2012mm小体积晶振,6G无线模块晶振 尺寸图
32.768K产品特性:
陶瓷接缝封装
卓越的可靠性性能
超微型封装
可用于表面安装技术和红外回流工艺
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