频率:32.768KHZ
尺寸:3.2x1.5mm
Bomar薄型晶振,BC46CFD112.5-32.768K,3215mm,32.768K无源晶体,尺寸3.2x1.5mm,频率32.768KHZ,欧美无源晶振,32.768KHZ音叉晶体,SMD晶振,3215系列SMD晶振,低功耗晶振,低损耗晶振,高性能晶振,BC46系列是一种超小型陶瓷smd晶体,高度为0.8毫米。非常适合最小的电路空间可能的应用包括移动通信、芯片卡、实时时钟和无线通信。产品被称为实时时钟晶振,芯片卡晶振,无线通信晶振,移动设备晶振,网络设备晶振,轻型晶振,32.768KHZ无源晶振,陶瓷晶振,无源贴片晶振,音叉晶体,超小型SMD晶振,3215mm无源晶振,具有轻薄小低损耗的特点。Bomar薄型晶振,BC46CFD112.5-32.768K,3215mm,32.768K无源晶体.
Bomar薄型晶振,BC46CFD112.5-32.768K,3215mm,32.768K无源晶体 参数表
Frequency Range | 32.768 kHz | |||||||||
Frequency Tolerance @ 25ºC. | ±10ppm, ±20ppm, ±50ppm | |||||||||
Temperature Coefficient | -0.040ppm / ºC² max. - See Graph Below | |||||||||
Operating Temperature Range | -40º to +85ºC. | |||||||||
Load Capacitance | 12.5pF, 9.0pF, 7.0pF, 4.0pF | |||||||||
Shunt Capacitance | 2pF max. | |||||||||
Equivalent Series Resistance | 80k ohms max. | |||||||||
Aging | ±3ppm/ 1st year max. | |||||||||
Drive Level | 1.0µW max. | |||||||||
Storage Temperature | -55º to +125ºC. |
Bomar薄型晶振,BC46CFD112.5-32.768K,3215mm,32.768K无源晶体 尺寸图
Bomar薄型晶振,BC46CFD112.5-32.768K,3215mm,32.768K无源晶体
产品特点:
尺寸3.2x1.5mm
回流焊接
工作温度-40º至+85ºC。
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