SG3225VAN爱普生LVDS差分晶振X1G004241015600,苹果手机A16芯片晶体

苹果手机A16芯片晶体管性能提升多少SG3225VAN爱普生LVDS差分晶振X1G004241015600

苹果在发布会上说,A16Bionic着力于3个部分,分别是能效powerefficiency、显示display和摄像头camera.抛开后两个不谈,只说能效而不说性能,或许说明了A16单纯在性能上的提升并不大-我们此前说A15以及相同CPU微架构的M2的CPU性能提升就不算特别大.爱普生晶振这是否表明了苹果这两年在芯片设计上遇到了瓶颈?当然能效上的打磨价值也非常大,这也一直是苹果的优势.前不久还谈过今年更早的那批所谓的4nm芯片大概率都是假4nm,而A16极有可能才是真4nm,是不是应该有点满意?

SG3225VAN爱普生晶振X1G004241015600,苹果手机A16芯片晶体

爱普生有源晶振编码	型号	频率	长X宽X高	输出波	电源电压	工作温度	频差
X1G004241014800	SG3225VAN	116.713000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-50ppm
X1G004241014900	SG3225VAN	322.265625MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-30ppm
X1G004241015000	SG3225VAN	133.333333MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-50ppm
X1G004241015100	SG3225VAN	108.000000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-30ppm
X1G004241015300	SG3225VAN	300.120000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-50ppm
X1G004241015400	SG3225VAN	160.000000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-50ppm
X1G004241015500	SG3225VAN	148.351648MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-30ppm
X1G004241015600	SG3225VAN	250.000000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-50ppm
X1G004241015800	SG3225VAN	243.000000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-30ppm
X1G004241016200	SG3225VAN	148.351648MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-20to70°C	+/-20ppm
X1G004241016300	SG3225VAN	108.000000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-20to70°C	+/-20ppm
X1G004241016400	SG3225VAN	148.351600MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-20to70°C	+/-20ppm
X1G004241016500	SG3225VAN	625.000000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-50ppm
X1G004241016700	SG3225VAN	144.000000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-30ppm
X1G004241016900	SG3225VAN	415.000000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-50ppm
X1G004241017100	SG3225VAN	128.000000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-20to70°C	+/-50ppm
X1G004241017200	SG3225VAN	128.000000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-50ppm
X1G004241017300	SG3225VAN	161.132812MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-30ppm
X1G004241017400	SG3225VAN	656.000000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-30ppm
X1G004241018000	SG3225VAN	657.000000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-30ppm
X1G004241018100	SG3225VAN	625.000000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-30ppm
X1G004241018400	SG3225VAN	148.350000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-50ppm
X1G004241018500	SG3225VAN	300.000000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-20to70°C	+/-20ppm
X1G004241018700	SG3225VAN	234.375000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-20to70°C	+/-30ppm
X1G004241018800	SG3225VAN	117.187500MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-20to70°C	+/-30ppm

苹果A16堆了160亿个晶体管——A15实则也有150亿晶体管,以及这颗新的SoC芯片在显示引擎和ISP上下了点工夫,那么堆料上能够分派给CPU、GPU的余地也就不大了.石英晶振所以性能提升真的不做好.不过A16用上了台积电的4nm工艺,比5nm先进不是?今年苹果iPhone14系列新品发布会,谈到A16芯片的部分信息算是很少；连往常都要出面谈两句AppleSilicon架构的JohnySrouji都没出现,就A16芯片都没有怎么介绍,实在是手机APSoC爱好者的不理解.