苹果手机A16芯片晶体管性能提升多少SG3225VAN爱普生LVDS差分晶振X1G004241015600
苹果在发布会上说,A16Bionic着力于3个部分,分别是能效powerefficiency、显示display和摄像头camera.抛开后两个不谈,只说能效而不说性能,或许说明了A16单纯在性能上的提升并不大-我们此前说A15以及相同CPU微架构的M2的CPU性能提升就不算特别大.爱普生晶振这是否表明了苹果这两年在芯片设计上遇到了瓶颈?当然能效上的打磨价值也非常大,这也一直是苹果的优势.前不久还谈过今年更早的那批所谓的4nm芯片大概率都是假4nm,而A16极有可能才是真4nm,是不是应该有点满意?
SG3225VAN爱普生晶振X1G004241015600,苹果手机A16芯片晶体
爱普生有源晶振编码
型号
频率
长X宽X高
输出波
电源电压
工作温度
频差
X1G004241014800
SG3225VAN
116.713000 MHz
3.20 x 2.50 x 1.20 mm
LVDS
2.250 to 3.630 V
-40 to 85 °C
+/-50 ppm
X1G004241014900
SG3225VAN
322.265625 MHz
3.20 x 2.50 x 1.20 mm
LVDS
2.250 to 3.630 V
-40 to 85 °C
+/-30 ppm
X1G004241015000
SG3225VAN
133.333333 MHz
3.20 x 2.50 x 1.20 mm
LVDS
2.250 to 3.630 V
-40 to 85 °C
+/-50 ppm
X1G004241015100
SG3225VAN
108.000000 MHz
3.20 x 2.50 x 1.20 mm
LVDS
2.250 to 3.630 V
-40 to 85 °C
+/-30 ppm
X1G004241015300
SG3225VAN
300.120000 MHz
3.20 x 2.50 x 1.20 mm
LVDS
2.250 to 3.630 V
-40 to 85 °C
+/-50 ppm
X1G004241015400
SG3225VAN
160.000000 MHz
3.20 x 2.50 x 1.20 mm
LVDS
2.250 to 3.630 V
-40 to 85 °C
+/-50 ppm
X1G004241015500
SG3225VAN
148.351648 MHz
3.20 x 2.50 x 1.20 mm
LVDS
2.250 to 3.630 V
-40 to 85 °C
+/-30 ppm
X1G004241015600
SG3225VAN
250.000000 MHz
3.20 x 2.50 x 1.20 mm
LVDS
2.250 to 3.630 V
-40 to 85 °C
+/-50 ppm
X1G004241015800
SG3225VAN
243.000000 MHz
3.20 x 2.50 x 1.20 mm
LVDS
2.250 to 3.630 V
-40 to 85 °C
+/-30 ppm
X1G004241016200
SG3225VAN
148.351648 MHz
3.20 x 2.50 x 1.20 mm
LVDS
2.250 to 3.630 V
-20 to 70 °C
+/-20 ppm
X1G004241016300
SG3225VAN
108.000000 MHz
3.20 x 2.50 x 1.20 mm
LVDS
2.250 to 3.630 V
-20 to 70 °C
+/-20 ppm
X1G004241016400
SG3225VAN
148.351600 MHz
3.20 x 2.50 x 1.20 mm
LVDS
2.250 to 3.630 V
-20 to 70 °C
+/-20 ppm
X1G004241016500
SG3225VAN
625.000000 MHz
3.20 x 2.50 x 1.20 mm
LVDS
2.250 to 3.630 V
-40 to 85 °C
+/-50 ppm
X1G004241016700
SG3225VAN
144.000000 MHz
3.20 x 2.50 x 1.20 mm
LVDS
2.250 to 3.630 V
-40 to 85 °C
+/-30 ppm
X1G004241016900
SG3225VAN
415.000000 MHz
3.20 x 2.50 x 1.20 mm
LVDS
2.250 to 3.630 V
-40 to 85 °C
+/-50 ppm
X1G004241017100
SG3225VAN
128.000000 MHz
3.20 x 2.50 x 1.20 mm
LVDS
2.250 to 3.630 V
-20 to 70 °C
+/-50 ppm
X1G004241017200
SG3225VAN
128.000000 MHz
3.20 x 2.50 x 1.20 mm
LVDS
2.250 to 3.630 V
-40 to 85 °C
+/-50 ppm
X1G004241017300
SG3225VAN
161.132812 MHz
3.20 x 2.50 x 1.20 mm
LVDS
2.250 to 3.630 V
-40 to 85 °C
+/-30 ppm
X1G004241017400
SG3225VAN
656.000000 MHz
3.20 x 2.50 x 1.20 mm
LVDS
2.250 to 3.630 V
-40 to 85 °C
+/-30 ppm
X1G004241018000
SG3225VAN
657.000000 MHz
3.20 x 2.50 x 1.20 mm
LVDS
2.250 to 3.630 V
-40 to 85 °C
+/-30 ppm
X1G004241018100
SG3225VAN
625.000000 MHz
3.20 x 2.50 x 1.20 mm
LVDS
2.250 to 3.630 V
-40 to 85 °C
+/-30 ppm
X1G004241018400
SG3225VAN
148.350000 MHz
3.20 x 2.50 x 1.20 mm
LVDS
2.250 to 3.630 V
-40 to 85 °C
+/-50 ppm
X1G004241018500
SG3225VAN
300.000000 MHz
3.20 x 2.50 x 1.20 mm
LVDS
2.250 to 3.630 V
-20 to 70 °C
+/-20 ppm
X1G004241018700
SG3225VAN
234.375000 MHz
3.20 x 2.50 x 1.20 mm
LVDS
2.250 to 3.630 V
-20 to 70 °C
+/-30 ppm
X1G004241018800
SG3225VAN
117.187500 MHz
3.20 x 2.50 x 1.20 mm
LVDS
2.250 to 3.630 V
-20 to 70 °C
+/-30 ppm
苹果A16堆了160亿个晶体管——A15实则也有150亿晶体管,以及这颗新的SoC芯片在显示引擎和ISP上下了点工夫,那么堆料上能够分派给CPU、GPU的余地也就不大了.石英晶振所以性能提升真的不做好.不过A16用上了台积电的4nm工艺,比5nm先进不是?今年苹果iPhone14系列新品发布会,谈到A16芯片的部分信息算是很少；连往常都要出面谈两句Apple Silicon架构的Johny Srouji都没出现,就A16芯片都没有怎么介绍,实在是手机APSoC爱好者的不理解.
SG3225VAN爱普生晶振X1G004241015600,苹果手机A16芯片晶体
